Earpiece and main speakers   


Water damage

In a standard smartphone design, holes need to be incorporated in both the touchscreen and the enclosure to allow sound to emit from the earpiece and main speakers. This significantly adds to the manufacturing expenses of the display. Furthermore, this design poses a risk of exposing the speakers directly to water, potentially diminishing audio quality and, over time, leading to potential harm to other internal components should water penetrate the phone’s membrane.


Screens become sound radiators

With a remarkable slim profile, as thin as 1mm, Dragonfly™ can be seamlessly attached to either the smartphone’s screen or rear housing, effectively transforming the phone enclosure into a speaker. Key advantages include:

  • Waterproof Capability: Since there are no holes or cutouts on the phone, it enables the smartphone to be waterproof.
  • Cost Reduction: This is achieved by eliminating the need for creating holes in the glass screen, resulting in reduced production costs.
  • 2-in-1 Sound and Haptic Functionality: Beyond acting as a speaker, Dragonfly™ can also serve as a haptic engine simultaneously. This presents a cost-saving opportunity, as one Dragonfly unit can replace the functions of all three components: earpiece, main speakers, and the haptic engine in the smartphone.


Sound directly from screen

In this quick demo, we attached a Dragonfly™ to the rear of a smartphone screen to showcase its capabilities. The audio performance of this setup is on par with that of the conventional phone speaker. As the entire screen vibrates, when placed on a surface, it effectively converts that surface into an additional sound emitter, enhancing the audio output. For further information, please feel free to reach out to us at contact@flora.tech!

Frequency response

Typical smartphone speaker


Other Applications

Unlock the potential

Being thin, lightweight, and efficient, Dragonfly™ offers distinct advantages that pave the way for a multitude of potential applications. It provides hardware designers with an exceptional opportunity to create innovative audio solutions that were previously beyond reach.